Stencil IC 3D / 3D IC Stencil / 3D钢网 Item Code: 76663
MECHANIC 3D-X Pro + Mold - iPhone X (A11)
ID: Platform reballing middle frame 3D merek MECHANIC model 3D-X Pro untuk iPhone X (chip A11). Set berisi mold/dudukan + stencil BGA 3D, desain groove 3D agar stencil cepat align dengan titik solder IC. Lubang persegi memudahkan pengambilan solder ball yang sudah terbentuk. Bahan stainless steel presisi laser cutting.
EN: 3D middle-frame reballing platform by MECHANIC, model 3D-X Pro, for iPhone X (A11 chip). Set includes mold/jig + 3D BGA stencil. 3D groove design aligns stencil quickly with IC tinning position; square holes make formed solder balls easy to remove. Precision laser-cut stainless steel.
CN: MECHANIC 3D-X Pro 中层板植锡平台，适用于iPhone X（A11 芯片）。含模具+3D BGA 植锡网，3D 凹槽设计快速对位，方孔易取锡球，精密激光切割不锈钢。
| Brand | MECHANIC |
| Model | 3D-X Pro + Mold |
| Target / Cocok untuk | iPhone X (A11 chip) middle frame / CPU reballing |
| Tipe | 3D middle-frame reballing platform + stencil |
| Bahan / Material | Stainless steel, laser-cut |
| Kualitas | Original |
| Satuan | 1 set (mold + stencil) |
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MECHANIC (维修佬) — tools service ponsel Shenzhen.
